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EpoxyBond 110

 
EpoxyBond 110™ is a hard, fast-curing epoxy adhesive commonly used to bond glass cover slips to small or delicate samples (i.e., ICs), adhere multiple samples for TEM stacking, precoat samples prior to encapsulation, fill PCB microvias and for other mounting applications. The two part formula is mixed 10 to 1 and cures in 5 minutes at 150 °C (302 °F). Once cured, it is chemically resistant to etchants and will not outgas under vacuum.
PRODUCT USE INSTRUCTIONS
SAFETY DATA SHEET


Item# Item Name Qty Add
71-10000 EpoxyBond 110 2-Part Adhesive, 0.5 oz.(15 mL) Kit, Includes 20 Mixing Cups, and Alligator Clips
71-10005 EpoxyBond 110 2-Part Adhesive, 4 oz. (120 mL) Kit, Includes 150 Mixing Cups, and 4 Alligator Clips
 


Extended Information:

This product can be used with mounting accessories offered by Allied and other manufacturers. Browse our machines >>




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