EpoxyBond 14™ is a clear, 2-part
epoxy resin ideal for applications such as: small area/thin bond line adhesion; filling opened/decapsulated die cavities for backside support; securing petro/geo samples to glass slides under vacuum.
Measured by weight in a 4:1 ratio, it is a pourable, low
viscosity resin featuring excellent chemical resistance and stability in an
SEM. Curing is possible in either 1 hour
@ 65 C or in 24 h @ room temperature. It is soluble in Epoxy Dissolver and has
a shore D hardness value of 85.
Compared to
EpoxyBond 110™, it cures clear and with less strain on the contact surfaces, so
may be more ideal when working with brittle materials.
PRODUCT USE INSTRUCTIONS
SAFETY DATA SHEET
