|
|
 |
 |
 |
|
EpoxyBond 110™ is a hard, fast-curing epoxy adhesive commonly used to bond glass cover slips to small or delicate samples (i.e., ICs), adhere multiple samples for TEM stacking, precoat samples prior to encapsulation, fill PCB microvias, and for other mounting applications. The two-part formula is mixed 10 to 1 and cures in 5 minutes at 150 °C (302 °F). The curing temperature can also be reduced to prevent damage to heat-sensitive samples. Once cured, it is chemically resistant to etchants and will not outgas under vacuum.
PRODUCT USE INSTRUCTIONS
SAFETY DATA SHEET
|
|
|
 |
|
 |
|
|
